Step-by-step

1. 1

   Remove the SIM Tray

   1 min

   Insert a SIM eject tool into the hole on the left edge of the phone. Press firmly to eject the SIM tray and remove it.

2. 2

   Heat the Rear Cover

   3 min

   Apply heat around the rear panel edges using a heat gun or iOpener for two minutes. Keep the heat moving to avoid warping the plastic panel.

3. 3

   Slice the Perimeter Adhesive

   4 min

   Insert an opening pick under the lower edge of the back panel. Carefully slide the pick around all edges to slice through the adhesive, then lift off the back cover.

4. 4

   Unscrew the Midframe Shield

   3 min

   Use a precision Phillips screwdriver to remove all visible screws securing the plastic midframe and camera housing.

5. 5

   Remove the Midframe

   2 min

   Insert a spudger between the midframe and the phone body. Pry gently around the edges to release the plastic clips and lift off the frame.

6. 6

   Disconnect the Battery

   1 min

   Use the flat end of a spudger to pry the battery press connector straight up from its socket. Disconnecting the battery immediately prevents further electrical shorting.

7. 7

   Disconnect Interconnect Cables

   2 min

   Pry up the display flex cable, main interconnect cable, and antenna coaxial cables attached to the motherboard.

8. 8

   Remove the Mainboard

   3 min

   Remove any remaining motherboard retaining screws. Lift the mainboard out from the top chassis housing.

9. 9

   Remove the Lower Speaker

   2 min

   Unscrew the Phillips screws securing the bottom speaker enclosure and pry it out of the phone frame.

10. 10

    Remove the Sub-Board

    2 min

    Disconnect the lower interconnect cable and lift the sub-board containing the USB-C port and headphone jack out of the bottom frame.

11. 11

    Clean Circuit Boards with Alcohol

    10 min

    Submerge the mainboard and sub-board in a container of 99% isopropyl alcohol. Scrub off liquid residue and corrosion gently using a soft nylon brush.

12. 12

    Inspect for Corrosion

    5 min

    Examine both circuit boards under a magnifying glass. Check all connectors, small resistors, and IC chips for remaining oxidation or burn marks.

13. 13

    Dry the Components

    15 min

    Place the cleaned boards on a lint-free towel in a warm, ventilated area. Allow them to dry completely for at least two hours before reassembly.

14. 14

    Reassemble the Device

    10 min

    Reinstall the sub-board and mainboard into the frame, reconnect all flex cables, screw down the midframe, and press the back cover on with fresh adhesive.