Step-by-step

1. 1

   Power off the device and eject the SIM card tray

   2 min

   Press and hold the power button to shut down the Moto G75 5G completely. Insert a SIM eject tool into the tray hole on the side to pop out the tray.

2. 2

   Heat the back cover edges

   3 min

   Apply a heat gun or heated iOpener around the outer perimeter of the back panel for two minutes to soften the adhesive.

3. 3

   Insert a plastic opening pick

   2 min

   Attach a suction cup near the bottom edge and pull upward slightly to create a gap. Slide a thin plastic pick under the rear glass edge.

4. 4

   Slice through the rear cover adhesive

   4 min

   Slide the pick around all four edges of the back cover to cut through the glue. Carefully lift the back panel off the frame.

5. 5

   Unscrew the top motherboard midframe

   3 min

   Use a precision Phillips screwdriver to remove all visible screws securing the upper protective bracket.

6. 6

   Remove the upper midframe cover

   2 min

   Insert a plastic spudger beneath the edge of the plastic bracket and lift it off the device.

7. 7

   Disconnect the battery cable

   1 min

   Pry the battery press connector straight up from the logic board to kill all power to the components.

8. 8

   Disconnect the display and interconnect cables

   2 min

   Use the flat end of a spudger to pop off the main ribbon flex cables connected along the lower section of the motherboard.

9. 9

   Unplug the coaxial antenna cables

   2 min

   Gently pry up the head of the white and black antenna cables from their sockets near the edge of the board using fine tweezers.

10. 10

    Remove the logic board retaining screw

    1 min

    Locate and remove the single Phillips screw holding the logic board down to the aluminum frame.

11. 11

    Pry up the logic board

    3 min

    Carefully insert a spudger under the top corner of the logic board and pivot it upward out of the phone body.

12. 12

    Inspect the logic board under magnification

    5 min

    Examine the board under a magnifying lamp to identify broken surface-mount components, cold solder joints, or corrosion spots.

13. 13

    Clean affected board areas

    3 min

    Dip a soft brush into high-purity isopropyl alcohol and gently scrub away oxidation or debris around damaged pins.

14. 14

    Apply liquid flux to damaged joints

    2 min

    Dispense a small amount of soldering flux onto the target pads or micro-components needing repair.

15. 15

    Reflow or solder the faulty components

    10 min

    Touch the preheated fine-tip soldering iron to the joint, applying fresh solder or reflowing existing solder until smooth shiny joints form.

16. 16

    Reinstall the logic board into the frame

    3 min

    Align the logic board back into the chassis top-first, taking care not to trap flex cables beneath it.

17. 17

    Reconnect all antenna cables and flex connectors

    3 min

    Press down firmly on the ribbon connectors and antenna heads until they snap securely back into place on the board.

18. 18

    Reattach the upper midframe and seal the back cover

    5 min

    Secure the motherboard bracket with its screws, reconnect the battery, apply new adhesive strips, and press the back cover firmly shut.