Step-by-step

1. 1

   Eject the SIM tray

   1 min

   Insert a SIM eject tool into the hole on the left edge of the phone to release the tray. Pull the SIM card tray completely out of the device.

2. 2

   Heat the back panel

   3 min

   Apply a heat gun or heated iOpener along the perimeter of the rear cover for 2 minutes. This softens the adhesive securing the plastic back panel.

3. 3

   Slice rear adhesive

   5 min

   Insert an opening pick into the seam between the back cover and the chassis near the bottom port. Carefully slide the pick around all four edges to cut the glue.

4. 4

   Pry off back cover

   2 min

   Gently lift the back cover off the chassis using a suction cup or opening tool. Set the cover aside on a clean work surface.

5. 5

   Remove upper midframe screws

   4 min

   Use a Phillips #00 screwdriver to remove all visible screws securing the top plastic motherboard shield. Organize the screws by location for reassembly.

6. 6

   Detach upper midframe

   2 min

   Insert a flat spudger under the edge of the upper plastic shield and pry gently to release the retaining clips. Lift the shield away from the phone.

7. 7

   Disconnect the battery cable

   1 min

   Use a plastic spudger to pry the battery press connector straight up off the motherboard. Disconnecting the power immediately stops active electrical corrosion.

8. 8

   Disconnect logic board flexes

   3 min

   Unplug the display flex cable, main interconnect flex, and antenna coax cables from the top board using a spudger.

9. 9

   Extract the motherboard

   3 min

   Remove any remaining single motherboard retaining screws using a Phillips driver. Carefully lift the logic board out of the phone chassis.

10. 10

    Remove bottom speaker housing

    3 min

    Unbolt the Phillips screws securing the lower speaker assembly and pry it out to access the bottom sub-board.

11. 11

    Scrub logic board with alcohol

    10 min

    Pour 99% isopropyl alcohol over the motherboard corrosion sites. Gently scrub mineral deposits and water residue using a soft anti-static brush.

12. 12

    Clean sub-board connectors

    8 min

    Apply isopropyl alcohol to the bottom daughterboard and flex cable connectors. Use the soft brush to remove liquid residue around the USB-C port.

13. 13

    Dry components with compressed air

    15 min

    Use short bursts of compressed air to blow away dislodged deposits and residual alcohol. Allow all cleaned boards to air-dry completely for at least 30 minutes.

14. 14

    Reinstall internal circuit boards

    4 min

    Place the dried motherboard and bottom sub-board back into their slots in the frame. Fasten their retaining screws tightly.

15. 15

    Reconnect internal cables and battery

    5 min

    Plug in all flex cables and antenna connectors, finishing with the main battery press cable. Reinstall the upper midframe cover and drive all shield screws.

16. 16

    Reseal the back panel

    10 min

    Apply fresh pre-cut adhesive strips or B-7000 liquid adhesive along the frame edges. Align the back cover, press down firmly, and clamp for 30 minutes.