Step-by-step

1. 1

   Power off and eject SIM tray

   1 min

   Turn off the Pixel 9 Pro XL completely. Insert a SIM eject tool into the hole at the bottom frame to pop out the SIM tray.

2. 2

   Heat the back glass edge

   3 min

   Apply a hot air station or heat gun around the outer edges of the back cover for 2-3 minutes to soften the perimeter adhesive.

3. 3

   Slice perimeter adhesive

   5 min

   Attach a suction cup near the bottom edge and pull up gently to create a gap. Insert a plastic opening pick and slide it around the perimeter to sever the glue.

4. 4

   Remove rear glass cover

   2 min

   Gently lift the back glass off the chassis. Set it aside on a clean surface.

5. 5

   Unscrew the midframe cover

   4 min

   Use your precision screwdriver set to remove the screws securing the metal graphite midframe and wireless charging coil assembly.

6. 6

   Disconnect the battery cable

   1 min

   Use a plastic opening tool to gently pry up the battery press connector from the motherboard to cut power.

7. 7

   Disconnect display and sub-board flexes

   3 min

   Unplug the display cable, daughterboard interconnect, and camera press connectors from the main board.

8. 8

   Remove motherboard mounting screws

   2 min

   Unscrew the remaining retaining screws holding the main logic board to the aluminum frame.

9. 9

   Extract the motherboard

   2 min

   Carefully pry up and lift the main motherboard out of the device chassis using a plastic spudger.

10. 10

    Mount board under microscope

    2 min

    Place the motherboard in a PCB holder directly under the microscope for high-magnification viewing of the Titan security chip.

11. 11

    Apply flux to Titan chip

    2 min

    Dispense a small amount of liquid no-clean flux around the perimeter of the Titan Security Chip BGA package.

12. 12

    Desolder the Titan chip

    4 min

    Set the hot air station to 350°C and heat the chip evenly until the solder reflows. Lift the chip vertically using precision tweezers.

13. 13

    Clean board solder pads

    4 min

    Apply flux and use a soldering iron with copper wick to absorb remaining solder from the motherboard pads. Clean with isopropyl alcohol.

14. 14

    Position replacement chip

    3 min

    Apply fresh flux to the pads and carefully align pin 1 of the new Titan chip with the matching silkscreen mark on the board using tweezers.

15. 15

    Reflow replacement Titan chip

    3 min

    Direct hot air vertically over the replacement chip until it settles into place onto the melted solder pads.

16. 16

    Inspect chip solder joints

    3 min

    Check the perimeter under the microscope to ensure all BGA solder joints have formed bridging-free connections.

17. 17

    Reinstall motherboard and connectors

    5 min

    Place the board back into the chassis, tighten its screws, and reconnect all display, camera, and battery flex cables.

18. 18

    Seal back glass

    4 min

    Apply new perimeter adhesive strips, align the back cover over the frame, and press firmly along the edges to seal.